B.I.C 63/37 SMD SMT Solder Paste is designed for electronic soldering applications that require reliable soldering performance and consistent results. Manufactured by Bajaj Insulation Co. (B.I.C Solder), a Delhi-based company with decades of experience in soldering materials and flux technology, this product is developed to support efficient soldering processes in electronics manufacturing and PCB assembly.
The solder paste combines a tin-lead alloy with a resin-based, no-clean flux system. Its formulation is intended to provide good soldering performance while minimizing the need for post-soldering cleaning in suitable applications.
What Is B.I.C 63/37 SMD SMT Solder Paste?
B.I.C 63/37 SMD SMT Solder Paste is a soldering material formulated with a 63% tin and 37% lead alloy. Commonly known as Sn63/Pb37 solder paste, this composition is widely associated with eutectic soldering because it melts at approximately 183°C without passing through a plastic temperature range.
The paste is intended for surface-mount technology (SMT) and surface-mount device (SMD) soldering applications. It helps establish electrical and mechanical connections between electronic components and printed circuit boards (PCBs).
Key Features of B.I.C SMD SMT Solder Paste
1. 63/37 Tin-Lead Composition
The 63/37 alloy provides a well-defined melting point, making it suitable for compatible electronics assembly processes that require predictable soldering behaviour.
2. Resin-Based No-Clean Flux
B.I.C SMD Paste features a medium-activity, resin-based no-clean flux formulation. It is designed for applications where flux residues can remain on the PCB, provided the finished assembly meets the required cleanliness and reliability standards.
3. Designed for SMD and SMT Applications
The product is developed for soldering processes involving surface-mount electronic components. Its suitability for a particular application depends on the PCB design, component requirements, application method, and production process.
4. Temperature Stability
According to the product information provided by B.I.C Solder, the paste can withstand room temperatures up to 35°C without lump formation under the stated conditions. Proper storage and handling are still essential to maintain product consistency.
5. Efficient Soldering Performance
The product is designed to support practical soldering operations and consistent results. Actual performance depends on factors such as solder paste application, stencil design, reflow temperature profile, and component compatibility.
Applications of 63/37 Solder Paste
B.I.C 63/37 SMD SMT Solder Paste can be considered for compatible electronic assembly and repair applications, including:
- Printed circuit board (PCB) assembly
- Surface-mount device soldering
- Electronic component mounting
- Electronics manufacturing and repair
- Soldering operations requiring a tin-lead alloy
Users should verify alloy compatibility, process requirements, and applicable regulations before selecting a lead-containing solder paste for production.
Benefits of No-Clean Solder Paste
No-clean solder paste is designed to reduce or eliminate routine post-soldering cleaning when the remaining flux residues are acceptable for the application. This can help simplify manufacturing workflows, reduce cleaning requirements, and improve production efficiency.
However, no-clean does not mean residue is suitable for every application. Sensitive electronic assemblies may require additional evaluation to ensure electrical performance, long-term reliability, and compliance with customer specifications.
B.I.C Solder Paste Solvent Recommendation
B.I.C Solder recommends its SMD Solvent as an associated product for improving solder paste handling and spreadability. The manufacturer also describes its use for paste dilution and achieving brighter solder joints.
Before adding any solvent, verify compatibility with the specific solder paste and follow the manufacturer’s technical instructions. Unapproved dilution can affect soldering quality and process reliability.
Why Choose B.I.C Solder?
Bajaj Insulation Co. has experience in solder wire, solder sticks, solder fluxes, SMD/SMT solder paste, PCB cleaning solvents, and related soldering products. Its product range supports different soldering requirements across industrial and electronic applications.
For businesses seeking 63/37 solder paste in India, B.I.C Solder offers a product option designed around resin-based no-clean flux technology and tin-lead soldering requirements.
Contact B.I.C Solder for Product Enquiries
Looking for B.I.C 63/37 SMD SMT Solder Paste for your electronics manufacturing or PCB assembly requirements? Contact Bajaj Insulation Co. to enquire about product availability, packaging, technical specifications, and purchasing options.
